Kandou AI Inc., a developer of copper-based interconnects for artificial intelligence chips, has raised $225 million in ...
Enhancements to Keysight's AresONE 1600GE and INPT-1600GE test platforms now expand 1.6T Ethernet interconnect validation to ...
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductor, Internet of Things (IoT) systems ...
Infraeo to showcase award-winning 1.6T and 800G AI interconnect technologies at OFC 2026, featuring Lightwave Innovation Awards recognition and live demonstrations with Marvell and Intel. ROUND ROCK, ...
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Aptiv’s Winchester Interconnect Launches Modulus™ Connector Platform for LEO and Drone Programs
New Modular, Field-Serviceable Solution Combines Single-Pair Ethernet and Configurable Power in a Single Ruggedized FootprintSCHAFFHAUSEN, Switzerland--(BUSINESS WIRE)--Aptiv PLC (NYSE: APTV), a ...
Enhancements to Keysight’s 89600 VSA software enable AttoTude to accelerate characterization of THz technology for AI data ...
Hyper Photonix, today announced a live demonstration of its next-generation 1.6 Tbps optical transceiver operating over 4-core multicore fiber (MCF) at the Optical Fiber Communication Conference (OFC) ...
Foxconn Interconnect Technology (FIT) showcased connectivity, power, and cooling solutions at multiple 2026 industry events ...
Combination of Molex VersaBeam EBO Backplane Connector and Teramount TeraVERSE detachable fiber connector boosts serviceability and slashes deployment time by 85% -- Enhanced CPO toolkit with ...
Launches aimed at supporting transition towards multi-rack scale-up and high-bandwidth scale-out in AI data centers ...
At embedded world 2026, Electronic Specifier Editor Mick Elliott speaks with Pierre Cardinal, Regional Sales Manager at ...
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